• 
• Mechanical Processing
• Anodize Processing
  (Alumite Processing)
• Joining
• Vacuum brazing and soldering
• Electron beam welding
• Clean Grinding Process Technology
• Interior grinding
• PSP Processing
• Wire Drawing Processing Technology
• Winding Technology and Insert Molding Technology
• Winding Technology
• Insert Mold Technology

Anodizing (Aluminum Products Only)

Outline

A full range of anodizing equipment for semiconductor and liquid crystal devices is available. A stable anodized membrane is achieved using individual process control for each product and auto control by computer. Further, various analyses of anodized membrane are possible using special evaluation equipment such as SEM & EDX and nanoindentors, etc.

Applications

• Semiconductors and liquid crystal manufacturing device parts

Characteristics

We can customize to fit the customer’s requests.

• Hard anodize processing is possible.
• Preprocessing and after-processing such as mirror surface processing are possible.

We can also handle chemical grinding process and precision washing process of large parts.

• Masking of flat surfaces, O rings, and interior of holes is also possible.
• We can handle all areas consistently, from materials designation to machining and anodizing.

Specifications

Anodizing

• Materials: Aluminum
• Processing method: Anodized sulfate processing
• Processing size: Up to liquid crystal G8 size is possible.

Membrane thickness: 5 to 80μm
Mist coating: Two types: Steam pressure (φ450mm) and pure water boiling