NIKKOSHI mechanical processing conforms to a wide variety of processes from aluminum alloys and very fine processing such as small holes and multiple holes, starting with CVD devices for semiconductor manufacturing device, to difficult-to-machine materials such as stainless steel and nickel.
- Outline
- We handle numerous parts for semiconductor manufacturing devices. We specialize in highly accurate turning processing and small hole and multiple hole processing.
- Applications
- CVD device parts for semiconductor and liquid crystal
- Etcher device parts for semiconductor
- CMP device parts for semiconductor
- Electronic parts
- Characteristics
- Random processing, and high-speed and highly accurate small aperture processing that pays close attention of post-processing flatness is achieved. 17,000 apertures max. are possible. We have a proven track record of processing 17,000 apertures max. (Hole processing scope: 950 x 750mm, hole diameter: φ0.4mm)
- We have a proven track record of deep aperture processing of depth/processing diameter= 50 min. (processing diameter: φ2.0mm, depth: φ100mm)
- Highly accurate turning processing (flatness 0.01 max.) is possible for difficult-to-machine materials such as stainless steel and nickel. Further, we have the technology for precision processing that satisfies surface roughness of Ra0.1 max.
- We can handle all areas consistently, from materials designation to mechanical processing and anodizing, etc.
- Specifications
- Machining Center
- Table size: 1500 x 1500mm; Max. No. of rotations: 36,000 times per minute
- CNC lathe
- Max. processing diameter: φ660mm; Max. processing length: 1,500mm
- Equipment Possessed
Machining Center
(We specialize in small hole and multiple hole processing.)
Machining Center
(We specialize in small hole and multiple hole processing.)
Machining Center
CNC lathe
Contact:
Equipment Parts Department
at +81-3-3270-8852
Equipment Parts Department
at +81-3-3270-8852
