Technical Information
Consistent handling from materials procurement to processing and surface processing.
  • Mechanical Processing

    MC1 NIKKOSHI specializes in small and multiple hole processing, starting with the upper electrode plates in CVD devices for semiconductor manufacturing device.

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  • Anodize Processing (Alumite Processing)

    Anodize Processing (Alumite Processing) NIKKOSHI performs special high-quality anodizing of semiconductor and liquid crystal manufacturing equipment. Various customizations to suit individual customer needs are also available.

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Joining

Clean Grinding Process Technology

  • Interior grinding
    Interior grinding

    NIKKOSHI offers a highly accurate finish to the interior of stainless steel capillaries using our special physical grinding methods.

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  • PSP Processing
    psp2

    It is possible to improve the essential fatigue strength of materials by eliminating defects in the processed surface layer.

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Wire Drawing Processing Technology

  • Wire Drawing Processing Technology

    NIKKOSHI is particularly skilled at wire drawing, rolling processing and clad layering processing.

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Winding Technology and Insert Molding Technology

  • Winding Technology コイル1

    NIKKOSHI can even wind bobbin-free coils using our in-house adhesion wires. Select the winding method for the winding materials according to the coil specifications.

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  • Insert Mold Technology
    Insert Mold Technology

    NIKKOSHI manufactures complex functional parts by forming coils and metal parts all-in-one (insert molding) with resin using a vertical molding device.

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