Wire Drawing Processing Technology

Wire Drawing Processing Technology
Outline
NIKKOSHI is particularly skilled at wire drawing ,rolling processing and clad layering processing.
Applications
There are a wide range of uses, including free alignment connectors, semiconductor PCB leads, diode leads, measuring devices, and sensors, etc.
Characteristics
The major characteristic is that the wire drawing and calendaring processing after plating enables an even membrane to be maintained concomitant with the fiber crystallization of the plated surface layer.
Wire Drawing Processing Technology
Specifications
Wire drawing is implemented using an extremely fine diameter of 7μφ, and calendaring processing is implemented using a thickness of 7μ x width 10μ. Consult NIKKOSHI directly for wire materials and sizes.
Example of product
0.020Φ Brass wire( Rolled Gold) 0.035Φ Pt wire
0.020Φ Brass wire
( Rolled Gold)
0.035Φ Pt wire
Contact:
Electronic Parts Department
at +81-3-3270-8853
Technical Information
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